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Vice President of Next Generation Solutions

As the Vice President of Next Generation Solutions, Mr. Lewis oversees PTI’s line of business focused on in-building DAS, outdoor DAS and small cell connectivity, edge data centers and enterprise private networks to support the next generation of wireless.

Mr. Lewis previously led commercial sales for the wireless business at Corning optical communications from 2018 to 2021 where he contributed to launching in-building 5G solutions for two major mobile network operators. Prior to Corning, Mr. Lewis served in leadership roles in wireless infrastructure firms, including American Tower Corporation where he served in various management functions from 2001 to 2007 and again as the head of wireless engineering and deployment function from 2011 to 2016. At American Tower Mr. Lewis contributed to the rapid expansion of DAS and fiber optic networks during the launch of 4G in the United States.

Mr. Lewis holds a Master of Business Administration from the University of Alabama and a Bachelor of Science in Engineering from Cornell University.

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